The global Fan-out Packaging
Materials and Equipment Market is estimated to grow at a CAGR of 16.09% during
the forecast period 2022-2027 and reach $3,418.7 million by 2027, from around
$1,318.2 million in 2021. Fan-out wafer level packaging (FOWLP) is one of the
latest packaging trends in microelectronics. Fan-Out (FO) packaging is
currently a niche market compared to other prominent packaging platforms,
however is analysed to grow at significant growth rate owing to its high-end
High-Density (HD) FO and low-end Core FO applications. The growing innovations
in ICT technologies such as 5G, cloud infrastructure, HPC applications are
analysed to be the key driving factors for the market during forecast period
Technological Advancement in Semiconductor based technology and quick rising demand in various industries are driving the growth of this market. Many manufacturing approaches in Fan Out have emerged in the race to provide the most reliable, highest-density solution. Fan Out is becoming not only more versatile, but it is also reaching high enough densities to provide a cost-effective alternative to 2.5D interposers. As the demand for Fan Out grows, packaging processes in both wafer and panel formats are being investigated. This creates a demand for new and better-performing materials that address more stringent specifications, such as finer line and space requirements, as well as the improved elongation required for advanced high-density Fan Out. To bridge these gaps, three new process approaches have been developed based on recent advancements in packaging materials. One approach involves the development of new carrier-assist release-layer materials for the redistribution layer (RDL)-first/chip-last build-up processes. Another significant advancement is the use of laser-ablated dielectric materials as an alternative to lithography dielectric patterning. Finally, a chip-first moulding process using a laminated die stencil and gap-fill materials is being developed as an alternative to the moulding process. For instance, in September 2019, Innolux Corp and the Industrial Technology Research Institute have agreed to collaborate on the development of fan-out panel-level packaging (FOPLP) for semiconductors.
Supply Chain disruption owing to impact of Covid-19 Pandemic is making an extremely negative high-impact in this market. The COVID-19 pandemic has resulted in a decrease in demand for semiconductor-powered products. Owing to the lockdown scenario, component production has come to a halt. The overall supply chain of the global fan-out WLP market has been disrupted as a result of this. The fan-out wafer level packaging industry, on the other hand, sees an opportunity in the unprecedented crisis as organizations begin to work from home and end-users consume more content on digital platforms. This has an impact on the importance of storage and memory solutions, such as compact, cost-effective high-powered packaged ICs for data centers, laptops, and other devices.
Carrier wafers are an integral part of the temporary bonding process and their selection basically depends on the type of bonding and debonding methods which can be employed. Once the product wafer is temporarily bonded to the carrier wafer, it is ready for backside processing including back-thinning, through-silicon via formation, etc. The product wafers can either be pre-processed wafers with CMOS devices as well as e.g. substrates with high-topographies such as solder-balls. Moreover 3M, provides the 3M™ OneFilm WSS Semiconductor Temporary Bonding Film Series (3M OneFilm) and 3M™ Wafer Support System (3M WSS) that help customers enable wafer- and panel-level packaging and their sophisticated fan-out wafer- and panel-level counterparts, by addressing their key thermal and chemical resistance challenges.
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Fan Out Packaging Materials and Equipment Market Growth Drivers:
Rising Demand for Semiconductor Sector
The growing semiconductor industry along with increasing demand of consumer electronics products such as smartphones and computer coupled with the wide usage of fan-out packaging materials and equipment is fueling its market growth. Moreover, the Indian semiconductor industry offers high growth potential areas as the industries which source semiconductors as inputs are themselves witnessing high demand. The end-use industries such as mobile devices, telecommunication, equipment, information technology, office automation, industrial machinery, automobiles and several other industries have application for computing in some form or other and thereby necessarily having growing demand for semiconductors. Hence, the growing semiconductor industry in APAC region is set to drive its market growth in the future. For instance, according to a study by the Associated Chambers of Commerce of India (ASSOCHAM) and EY, the Indian electronics and hardware industry is expected to reach US$112-130billion by 2018 as electronics and hardware manufacturers are looking to increase their manufacturing base in India to cater to the domestic market in the Middle East, Africa and SAARC countries.
The Major Players in this Market Include
Major players in Fan Out Packaging Materials and Equipment Market include TSMC, ASE Group, JCET Group, Amkor, PTI, Nepes Laweh, Samsung Electronics, Evatec, Camtek and Atotech among others. In November 2021, Amkor Technology announced its plans to expand its advanced packaging technology capacity by building a new factory in Bac Ninh, Vietnam.