APAC Broadband PowerLine Communications Chipset Market - Forecast(2019 - 2024)

Report Code: ESR 0603 Report Format: PDF + Excel (Delivery in 48 Hrs)
1. APAC Broadband PowerLine Communications Chipset– Market overview
2. Executive Summary
3. APAC Broadband PowerLine Communications Chipset– Market Landscape
3.1. Historical Market Share Analysis (2014-2017)
3.2. Comparative Analysis
3.2.1. Product Benchmarking
3.2.2. End User Profiling
3.2.3. Patent Analysis
3.2.3.1. By Company
3.2.3.2. By Year
3.2.3.3. By Region
3.2.4. Top 5 Financial Analysis
4. APAC Broadband PowerLine Communications Chipset– Market Forces
4.1. Market Drivers
4.2. Market Constraints
4.3. Market Challenges
4.4. Attractiveness of Broadband PowerLine Communications Chipset Market
4.4.1. Power of Suppliers
4.4.2. Power of Customers
4.4.3. Threat of new Entrants
4.4.4. Threat of Substitutions
4.4.5. Degree of Competitions
5. APAC Broadband PowerLine Communications Chipset- Strategic Analysis
5.1. Value Chain Analysis
5.2. Pricing Analysis
5.3. Opportunities Analysis
5.4. Product/Market Lifecycles Analysis
5.5. Suppliers and Distributors
6. APAC Broadband PowerLine Communications Chipset-By Standards
6.1. Homeplug AV
6.1.1. HomePlug AV1
6.1.2. HomePlug AV2
6.2. IEEE 1901
6.3. IEEE 1905.1
6.4. G.Hn
6.5. HomePNA
6.6. Others
7. APAC Broadband PowerLine Communications Chipset-By Definition
7.1. High Definition
7.2. Non-High Definition
8. APAC Broadband PowerLine Communications Chipset-By Technology
8.1. Standalone
8.2. Hybrid
8.2.1. Wi-Fi
8.2.2. Zigbee
8.2.3. Ethernet
8.2.4. Others
9. APAC Broadband PowerLine Communications Chipset-By Application
9.1. Networking
9.1.1. VOIP
9.2. Security & Surveillance
9.3. Machine to Machine
9.4. Home Automation
9.4.1. High and standard-definition television (HDTV, SDTV)
9.4.2. Digital multimedia file-sharing 
9.4.3. Home Networks
9.4.4. Interactive Gaming
9.4.5. Others
9.5. Smart Grid
9.5.1. Electric Meters
9.5.2. Solar Inverters
9.5.3. security monitoring
9.5.4. PLC Data Concentrators
9.5.5. Others
9.6. Electric Vehicle Communication
9.7. Industrial Automation
9.7.1. Motor Control
9.7.2. Remote Monitoring & Control
9.7.3. Others
9.8. Commercial
9.8.1. Advertising
9.8.2. Business
9.9. Others
10. APAC Broadband PowerLine Communications Chipset-By Modulation
10.1. Single
10.2. Multi
10.3. Spread Spectrum
11. APAC Broadband PowerLine Communications Chipset-By Voltage
11.1. Low (Less than 24V)
11.2. Medium (24V to 110V)
11.3. High (Greater than 110V)
12. APAC Broadband PowerLine Communications Chipset-By Component
12.1. System on Chip
12.2. Microcontroller Unit
12.3. PHY Base Band
12.4. Memory
12.5. Front End
12.6. Amplifier
12.7. Data Converter
12.8. Others
13. APAC Broadband PowerLine Communications Chipset-By Technologies
13.1. DCSK
13.2. OFDM
13.3. FSK
13.4. Others
14. APAC Broadband PowerLine Communications Chipset- By End-User Industry
14.1. Home Networking
14.2. Communication
14.3. Factory Automation
14.4. Education
14.5. Building Automation
14.6. Enterprise
14.7. Healthcare
14.8. Transportation
14.9. Others
15. APAC Broadband PowerLine Communications Chipset- By Integration
15.1. Single Chip
15.2. Multi Chip
16. APAC Broadband PowerLine Communications Chipset-By Geography
16.1. Introduction
16.2. APAC
16.2.1. China
16.2.2. Japan
16.2.3. Taiwan
16.2.4. Rest of APAC
17. Market Entropy
17.1. New Product Developments
17.2. Product launches, JVs, Mergers and Acquisitions
18. Company Profiles
18.1. Yitran Technologies Ltd.
18.2. Megachips Corp.
18.3. Semtech Corp.
18.4. Maxim Integrated
18.5. Broadcom Ltd.
18.6. ST Microelectronics
18.7. Qualcomm Inc. (Atheros)
18.8. Vango Technologies, Inc.
18.9. Marvell Technology Group
18.10. Intel Inc. (Lantiq)
18.11. Atmel
18.12. Sigma Designs
18.13. Max Linear Inc. (DS2)
18.14. Xeline Co.Ltd.
18.15. Xingtera Inc.
18.16. Greenvity Communications
19. Appendix
19.1. Abbreviations
19.2. Sources
19.3. Research Methodology
19.4. Bibliography
19.5. Compilation of Expert Insights
19.6. Disclaimer