The Thin Wafer Processing & Dicing Equipment Market size is estimated to reach US$890.2 million by 2028, growing at a CAGR of 7.1% from 2023 to 2028. The growing demand for three-dimensional integrated circuits, which are widely used in miniature semiconductor devices is expected to drive demand for thin wafer processing and dicing equipment during the forecast period. Additionally, advancements in advanced packaging technologies are also creating opportunities for market growth. In February 2021, TSMC announced that the company plans to establish an R&D center in Tsukuba to develop 3D IC packaging materials. However, high maintenance and fabrication costs are hampering the market growth.

Moreover, the growing adoption of radio-frequency electromagnetic waves for data transfer, increasing usage of healthcare asset tracking devices and the rising adoption of RFID technology for reducing medication errors and combating counterfeit are boosting the RFID application segment of the Thin Wafer Processing & Dicing Equipment market. In June 2022, Indira Gandhi International Airport adopted RFID technology to provide passengers with real-time information about their luggage. Such developments are poised to increase the market size.

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APAC generated approximately 27% of the global revenues in the Thin Wafer Processing & Dicing Equipment industry in 2022. Growing sales for smartphones, high uses of semiconductors and integrated circuits across various industry verticals are boosting the Thin Wafer Processing & Dicing Equipment market in this region. In FY 2021, according to Semiconductor Industry Association, semiconductor sales reached US$ 555.89 billion in the U.S., due to the growing electronics industry and competitiveness in the market.

Thin Wafer Processing & Dicing Equipment Market Growth Drivers:

Advancements in 3D packaging technologies:

High-performance integrated circuits such as 3D ICs are emerging as a viable solution for providing high performance, increased functionality and reduced power consumption to meet the requirements of electronic devices in the growing microelectronics and semiconductor industry. The growing adoption of advanced technologies such as AI, IoT, 5G and high-performance computing is escalating the demand for 3D IC packaging technology, which delivers enhanced performance and bandwidth with lower latency. In October 2021, Cadence Design Systems announced the release of the Integrity 3D-IC platform. It is the industry's first high-capacity, all-in-one 3D-IC platform, combining 3D implementation, system analysis and design planning into a single, unified cockpit. Furthermore, in May 2021, Intel announced an investment of US$3.5 billion in its Rio Rancho facility to support its advanced 3D packaging and manufacturing technology - "Foveros". Such advancements would positively influence the Thin Wafer Processing & Dicing Equipment industry outlook during the forecast period.

Major Players in this Market

The major players in the Thin Wafer Processing & Dicing Equipment Market include Suzhou Delphi Laser Co., Synova, Plasma-Therm LLC, UTAC Holding, Ltd., IBM and Disco Corporation. In October 2022, Siltronic opened a new wafer fab facility at JTC’s Tampines Wafer Fab Park in Singapore in a collaboration with Singapore Economic Development Board to meet the growing semiconductor demand.

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