The Thin Wafer Processing & Dicing
Equipment Market size is estimated to reach US$890.2 million
by 2028, growing at a CAGR of 7.1% from 2023 to 2028. The growing demand for three-dimensional
integrated circuits, which are widely used in miniature semiconductor devices
is expected to drive demand for thin wafer processing and dicing equipment during
the forecast period. Additionally, advancements in advanced packaging
technologies are also creating opportunities for market growth. In February
2021, TSMC announced that the company plans to establish an R&D center in
Tsukuba to develop 3D IC packaging materials. However, high maintenance and
fabrication costs are hampering the market growth.
Moreover, the growing adoption of radio-frequency electromagnetic waves for data transfer,
increasing usage of healthcare asset tracking devices and the rising adoption of RFID
technology for reducing medication errors and combating counterfeit are
boosting the RFID application segment of the Thin Wafer Processing & Dicing Equipment market. In June 2022,
Indira Gandhi International Airport adopted RFID technology to provide
passengers with real-time information about their luggage. Such developments are
poised to increase the market size.
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approximately 27% of the global revenues in the Thin Wafer Processing &
Dicing Equipment industry in 2022. Growing
sales for smartphones, high uses of semiconductors and integrated circuits
across various industry verticals are boosting the Thin Wafer Processing &
Dicing Equipment market in this region. In FY 2021, according to Semiconductor
Industry Association, semiconductor sales reached US$ 555.89 billion in the
U.S., due to the growing electronics industry and competitiveness in the market.
Wafer Processing & Dicing Equipment Market Growth Drivers:
in 3D packaging technologies:
High-performance integrated circuits such as 3D ICs are
emerging as a viable solution for providing high performance, increased
functionality and reduced power consumption to meet the requirements of
electronic devices in the growing microelectronics and semiconductor industry.
The growing adoption of advanced technologies such as AI, IoT, 5G and
high-performance computing is escalating the demand for 3D IC packaging
technology, which delivers enhanced performance and bandwidth with lower
latency. In October 2021, Cadence Design Systems announced the release of the
Integrity 3D-IC platform. It is the industry's first high-capacity, all-in-one
3D-IC platform, combining 3D implementation, system analysis and design
planning into a single, unified cockpit. Furthermore, in May 2021, Intel announced an investment of US$3.5 billion in its Rio Rancho facility to support its advanced 3D packaging and
manufacturing technology - "Foveros". Such advancements would positively influence
Wafer Processing & Dicing Equipment industry outlook during the forecast
Major Players in this Market
The major players in the Thin Wafer Processing & Dicing Equipment Market include Suzhou
Delphi Laser Co., Synova, Plasma-Therm LLC, UTAC Holding, Ltd., IBM and Disco Corporation. In October 2022, Siltronic opened a new wafer fab facility at JTC’s
Tampines Wafer Fab Park in Singapore in a collaboration with Singapore Economic
Development Board to meet the growing semiconductor demand.
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