Flip Chip Market - Forecast(2022 - 2027)

Report Code: ESR 0201 Report Format: PDF + Excel

Flip Chip Market Overview

The global Flip Chip market size is forecast to reach US$ 25 billion by 2027, growing at a CAGR of 6.8% from 2022 to 2027. Flip chip, also known as controlled collapse chip connection, is a method for interconnecting dies such as semiconductor devices, Integrated circuits (IC) chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done through metal bumps of solder, copper or nickel or gold. The growth contributing factors include need of data transmission between devices on higher frequency, increasing research in micro electrical mechanical systems (MEMS) technologies for flip chips and growing government initiatives to boost the flip chip market. However, expensive raw material and fabrication process as well as some technical limitations such as heat dissiiation issue, low mechanical strength hinder the growth of flip chip market.

Flip Chip Market Report Coverage

The report: “Flip Chip Industry Outlook – Forecast (2022-2027)”, by IndustryARC covers an in-depth analysis of the following segments of the Flip Chip industry.

By Solder: Copper pillar, Tin, Tin-Lead, Lead free, High Lead, Gold, Electrically Conductive Epoxy Adhesives, Eutectic, Others
By Substrate: Laminates, Ceramics, Polyamides, Glass, Silicon, Others
By Bonding: Adhesion Mechanism, Metallurgical bonding, Direct bonding, Hydrogen bonding, Mechanical interlocking, Vitreous bonding
By Solder technique: Solder Bumping, Stud Bumping, Adhesive Bumping
By Packaging: Flip Chip Ball Grid Array (FC BGA), Flip Chip-Pin Grid Array (FC PGA), Flip chip Land Grid Array (FC LGA), Flip Chip System In A Package (FC SiP), Flip Chip Chip Scale Package (FC CSP), Wafer Level Chip Scale Package (WLCSP), Flip Chip Quad Flat No Lead (FCQFN)
By Application: Memory based, RF,Analog, Mixed Signal and Power IC (2D IC, 2.5D IC, 3D IC ), Sensors (IR sensors, CMOS Image sensors, Others ), Light emitting diode, Central processing unit, Graphics processing unit, System-on-a-chip, Optical devices, Micro electrical mechanical systems (MEMS) devices, Surface acoustic wave (SAW) devices, Others
By End user : Consumer electronics, Automotive, Industrial equipments, Healthcare, Military & defense, Aerospace, IT & Telecom, Others
By Geography: North America (U.S, Canada, Mexico), Europe(U.K, Germany, France, Italy, Spain,Others), APAC (China, Japan, South Korea, India, Australia, Others), South America (Brazil, Argentina, Others), RoW (Middle East, Africa)

Key Takeaways

  • The copper pillar segment held the largest market in the flip chip market segmented by solder. This is owing to the efficient conductivity, the demand for improved performance and lower power consumption.
  •  The military and defence segment held the largest share in Flip Chip market by application, in 2021. This is attributed to demand for automation in armaments, advanced security systems and demand of portable and compact military devices.
  • APAC (Asia-Pacific) market held the largest market share of 37%, in 2021. This is due to abundant availability of raw materials in Asian countries and increasing research in micro electrical mechanical systems (MEMS) and system-on-a-chip (SoC) technologies for flip chips.
  •  The growth in demand of portable and compact circuit devices, need of data transmission between devices on higher frequency and increasing research in micro electrical mechanical systems (MEMS) technologies for flip chips are the contributing factors in the growth of flip chip market.

Flip Chip Market Value Share, By Geography, 2021 (%)

Flip Chip Market

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Flip Chip Market Segment Analysis- By Solder

The flip chip market by solder has been segmented into copper pillar, tin, tin-lead, lead free, high lead, gold, electrically conductive epoxy adhesives, eutectic, and others. The copper pillar segment held the largest share of 70%, in 2021. This is owing to greater control of the joint diameter and standoff height, finer-pitch joints and improved electrical performance. There are more advantages of copper pillar use over traditional solders such as improved electromigration resistance, improved thermal conductivity, simplified under bump metallization, and higher input-output density. In August 2021, AMD is the first vendor to unveil chips using copper hybrid bonding, an advanced die-stacking technology that enables next-generation 3D-like devices and packages. Hybrid bonding stacks and connects chips using tiny copper-to-copper interconnects, providing higher density and bandwidth than existing chip-stacking interconnect schemes. Intel’s 3D CPU, HBM, and other chips use tiny copper microbumps as the interconnect schemes in the package, along with a flip-chip process. Thus, copper pillar bumping technology is continuously progressing to improvise the overall performance of the electronic device which helps in boosting the growth of the market.

Flip Chip Market Segment Analysis- By End User

The flip chip market by end user has been segmented into consumer electronics, automotive, industrial equipments, healthcare, military and defense, aerospace, IT and telecom, others. The military and defence segment held the largest share of 25%, in 2021. This is because of growing use of sensor technology, automated security systems and advanced arms and ammunitions. This drives requirements for flip chip technology in military computing platforms. For military requirements, the need to cool components down to lower temperatures that has led to the development of a technology-based on indium micro pumps. For any radar, packaging and assembly are essential to improve its performance. As radar applications proliferate, cost becomes critical. Hence, flip chips are often adopted due to its high frequency operations. In May 2020, Semiconductor firm Qorvo announced that it has secured a new contract with the U.S. Department of Defense (DoD). The aim is to further advance the development of copper-pillar-on-GaN flip-chip technology. Thus, growing research and applications in military and defence field assists in the flip chip market growth.

Flip Chip Market Segment Analysis- By Geography

The Flip Chip market by geography is segmented into North America, Europe, Asia-Pacific (APAC), South America, and the rest of the world (RoW). APAC (Asia-Pacific) held the largest Flip Chip market share with 37% of total market size. This is due to availability of flip-chip raw materials, manufacturing equipments, growing research in advanced flip chip technologies such as MEMs and system on a chip (SoC) and growing government initiatives in asian countries. High integration density, larger I/O counts, faster speed and better signal intensity provided by flip chip packages also contribute to the market growth. In April 2022, Samsung announced that it will be supplying Flip Chip Ball Grid Array FC-BGA chip to Apple for its next-generation M2 processor. Due to the growing demand of Apple’s substrate chip in its latest MacBook series of laptops, tablets and iPads will be supplied by Samsung. Recently, In March 2022, Samsung Electro-Mechanics and LG Innotek, the two major IT component makers in Asia-Pacific announced to expand in the market with a next-generation semiconductor packaging substrate called flip chip ball grid array (FCBGA), increasing the investment in this sector to compete against Japanese and Taiwanese competitors as per the company officials statement. Thus, growing demand and expanding manufacturing of flip chips is helping the growth of APAC market. 

Flip Chip Market Drivers

There is an increasing demand of applications with high frequency which contributes in the growth of flip chip market

Rising demand for high-frequency microwave, ultrasonic frequency operations and rise in demand for high-speed portable devices are expected to contribute toward the growth of the global flip chip market. There is also high growth in monolithic microwave integrated circuits (MMIC) as they are devices that operate at microwave frequencies ranging from 300 MHz to 300 GHz. These devices typically perform functions such as microwave mixing, power amplification, low-noise amplification, and high-frequency switching. One major advantage that flip chip offers over other technologies is its ability to provide data transmission between devices on higher frequency. This is attributed to the connections are made through bumps in flip chips, which reduce the length and in turn offer improved electrical efficiency. In February 2022, a communication chip firm RFHIC is in process to secure around 80 billion won in government subsidies for the development of chips related to satellite communication. The company is planning to expand its development gallium nitride (GaN) monolithic microwave IC (MMIC) to include modules and platform, sources said. GaN-based MMIC is especially in high demand for satellite communication applications, as power consumption in space is limited. Thus, growing applications for high frequency requirements in various verticals is driving the flip chip market growth.

The increasing circuit miniaturization and need of replacement of conventional processes for technological advances helps to boost the market growth.

There is an increasing demand of miniaturization in electronic devices, enhanced electrical efficiency, and less power consumption. Flip-chip processes allow miniaturization of electronic circuitry by utilizing integrated circuit (IC) chips. For instance, increase in demand of compact, high speed processors and graphic cards required to fit in limited space of mobiles, laptops or game consoles and Sensors for IoT are miniaturized and require high performance to work in harsh operating environments, All these factors are driving the demand of flip chips that provide faster performance in the circuits. In conventional packaging, the interconnection between the die and the carrier is made using wire. This wire bonding has many drawbacks; hence flip chip packaging is adopted.  Flip chip provides superior thermal and electrical performance, the highest I/O capability, and substrate flexibility for varying performance requirements than conventional wire bond packaging. Thus, growing miniaturization and drawbacks of conventional processes is driving the flip chip market. In December 2021, Thomasnet launched Hi-Watty Light which has its applications in automated semiconductor test systems for automotive engineering or in the context of flip-chip assembly, a high-tech process for contacting microelectronic elements without housing. It can be also used in semiconductor and medical technology, as well as in the automotive and aerospace industries. Thus, growing miniaturization requirements is boosting the use of flip chips in multiple industries which drives the growth of this market.

Flip Chip Market Challenges

The bumping of beads make stiff and short prone to cracking and need of extreme flat surfaces for heat dissipation acts as a restraining factor for the growth of flip chip market

Flip Chips connect a semiconductor die to a substrate; the dies are bumped and then flipped onto a substrate. Bumps are placed directly on the die input-output pads typically distributed in an array across the entire die surface. As the chip is directly connected to the circuit board, the wire is shorter, resulting in less resistance and faster signal transmitting. However, this short distanced bumps lack mechanical strength and in case of thermal expansion mismatch are vulnerable to cracking at higher temperatures. Another issue arising is efficient heat removal and dissipiation, as amplifier or other components are suspended over a substrate on metal bumps that act as thermal stand-offs. a common design approach is to use a low-loss substrate combined with a flip-chip device and on-module EMI shielding. In 2021, a research report by showed that silicones filled with metal or metal-coated particles can provide reliable heat shielding along with dependable electrical conductivity to reduce the issue of heat dissipiation in flip chips. Another instance of Xradia's VersaXRM™ 3D X-ray microscope enables high resolution imaging of bump cracks and voids down to submicron levels, even for large packages without any sample preparation. In the case of flip chips, bumps connect the chip to the package substrate, soldered into place are difficult to look for soldering faults without destruction of sample. Thus, many such efforts are made to detect failure of flip chips at early stage. These mechanical failures and other technical issues are restraining the flip chip market growth.

Flip Chip Market Landscape

Product launches, acquisitions, and R&D activities are key strategies adopted by players in the Flip Chip industry. The Flip Chip top 10 companies include:

  1. Texas Instruments
  2. STMicroelectronics
  3. Intel Corporation
  4. Samsung Group
  5. Amkor Technology
  6. TDK Electronics Europe
  7. IBM Corporation
  8. Taiwan Semiconductor Manufacturing Company
  9. 3M Company
  10. Kyocera International

Recent Developments:

  • In May 2022, -Phison Electronics Corp. a leading provider of NAND controller and NAND storage solutions integration services, announced today that it is successfully deploying the world's first PCIe 5.0 Redriver IC PS7101 certified by the PCI-SIG Association to help solve the compatibility problems of high-speed signal transmission between CPU (Central Processing Unit) and peripheral devices (such as SSD and graphics card, etc.). The PCIe 5.0 Redriver IC PS7101 adopts Flip-Chip packaging and testing technology to reduce signal reflection and crosstalk interference caused by IC packaging. Thus, growing use of flip chip technology in innovative products will help in the market growth.
  •  In May 2022, Faraday Technology Corporation a leading ASIC design service and IP provider, announced that its Gigabit Ethernet PHY has been silicon proven on UMC’s 28HPC+ process and is now available for new ASIC SoC designs and IP licensing. This new IP, based on 28nm node, provides the benefits of low power-consumption and high performance. In addition, the solution supports flip-chip and wire-bond layouts to meet the customer’s package requirement for high performance SoC or cost effective applications. Thus, flip chip compatible products will assist in boosting the demand in the market.
  • In March 2022, -Teledyne e2v HiRel announced the new TD99102 UltraCMOS® High-speed FET and GaN transistor driver offering very high switching speed of 20 MHz. The new flip-chip part is ideal for driving Teledyne HiRel’s 100 V high reliability GaN HEMT devices in DC-DC, AC-DC converters, orbital Point-of-Load (POL) modules and space motor drives. Hence, this new product shall help the company to aquire a significant market share in flip chip market.
  •  In December 2021, Dow announced to preview its latest silicone technologies for advanced semiconductor packaging at SEMICON® Taiwan 2021. Dow’s hybrid solutions combine silicone and organics in a unique formulation. These adhesives deliver enhanced mechanical properties that silicone alone can’t achieve, such as higher modulus and strong adhesion to various surfaces. Potential applications include flip chip packaging, which can experience delamination after harsh reliability testing when epoxy mold underfill is used.Thus, this new material assisting to reduce the drawback in flip chip will help in growth of the market.

Relevant Report Titles:

Advanced Semiconductor Packaging Market -Forecast(2022 - 2027)

Report Code: ESR 0402

Wafer And Integrated Circuits Market - Forecast 2021 - 2026

Report Code: ESR 61874

Mems Sensor Market - Forecast 2021 - 2026

Report Code: ESR 89961

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1. Flip Chip Market Overview
    1.1 Definitions and Scope
2. Flip Chip Market - Executive Summary
    2.1 Market Revenue, Market Size and Key Trends by Company
    2.2 Key trends By Product Type
    2.3 Key trends segmented by Geography
3. Flip Chip Market– Market Landscape
    3.1 Comparative Analysis
        3.1.1 Product/Company Benchmarking-Top 5 Companies
        3.1.2 Top 5 Financial Analysis
        3.1.3 Market Value Split by Top 5 Companies
        3.1.4 Patent Analysis
        3.1.5 Pricing Analysis(Comparison of General Price Offerings in the Market)
4. Flip Chip Market– Startup Company Scenario (Premium)
    4.1 Venture Capital and Funding Scenario
    4.2 Startup Company Analysis
5. Flip Chip Market– Industry Market Entry Scenario Premium (Premium)
    5.1 Regulatory Scenario
    5.2 Ease of Doing Business Index
    5.3 Case Studies
    5.4 Customer Analysis
6. Flip Chip Market- Market Forces
    6.1 Market Drivers
    6.2 Market Constraints
    6.3 Porters five force model
        6.3.1 Bargaining power of suppliers
        6.3.2 Bargaining powers of customers
        6.3.3 Threat of new entrants
        6.3.4 Rivalry among existing players
        6.3.5 Threat of substitutes
7. Flip Chip Market– By Strategic Analysis (Market Size -$Million/Billion)
    7.1 Value Chain Analysis
    7.2 Opportunities Analysis
    7.3 Product Life Cycle/Market Life Cycle Analysis
    7.4 Suppliers and Distributors
8. Flip Chip Market – By Solder
    8.1 Copper 
    8.2 Tin
    8.3 Tin-Lead
    8.4 Lead free
    8.5 High Lead
    8.6 Gold
    8.7 Electrically Conductive Epoxy Adhesives
    8.8 Eutectic
    8.9 Others
9. Flip Chip Market – By Substrate
    9.1 Laminates
    9.2 Ceramics
    9.3 Polyamides
    9.4 Glass
    9.5 Silicon
    9.6 Others
10. Flip Chip Market – By Bonding
    10.1 Adhesion Mechanism
    10.2 Metallurgical bonding
    10.3 Direct bonding
    10.4 Hydrogen bonding
    10.5 Mechanical interlocking
    10.6 Vitreous bonding
11. Flip Chip Market – By Solder technique
    11.1 Solder Bumping
    11.2 Stud Bumping
    11.3 Adhesive Bumping
12. Flip Chip Market – By Packaging
    12.1 Flip Chip Ball Grid Array (FC BGA)
    12.2 Flip Chip-Pin Grid Array (FC PGA)
    12.3 Flip chip Land Grid Array (FC LGA)
    12.4 Flip Chip System In A Package (FC SiP)
    12.5 Flip Chip Chip Scale Package (FC CSP)
    12.6 Wafer Level Chip Scale Package (WLCSP)
    12.7 Flip Chip Quad Flat No Lead (FCQFN)
13. Flip Chip Market – By Application
    13.1 Memory based
    13.2 RF, Analog, Mixed Signal and Power IC
        13.2.1 2D IC
        13.2.2 2.5D IC
        13.2.3 3D IC
    13.3 Sensors
        13.3.1 IR sensors
        13.3.2 CMOS Image sensors
        13.3.3 Others
    13.4 Light emitting diode
    13.5 Central processing unit
    13.6 Graphics processing unit
    13.7 System-on-a-chip
    13.8 Optical devices
    13.9 Micro electrical mechanical systems (MEMS) devices
    13.10 Surface acoustic wave (SAW) devices
    13.11 Others
14. Flip Chip Market– By End user
    14.1 Consumer electronics
    14.2 Automotive
    14.3 Industrial equipment
    14.4 Healthcare
    14.5 Military & Defense
    14.6 Aerospace
    14.7 IT & Telecom
    14.8 Others
15. Flip Chip Market- By Geography (Market Size -$Million/Billion)
    15.1 North America
        15.1.1 U.S
        15.1.2 Canada
        15.1.3 Mexico
    15.2 Europe
        15.2.1 Germany
        15.2.2 France
        15.2.3 UK
        15.2.4 Italy
        15.2.5 Spain
        15.2.6 Russia
        15.2.7 Others
    15.3 APAC
        15.3.1 China
        15.3.2 Japan
        15.3.3 South Korea
        15.3.4 India
        15.3.5 Australia
        15.3.6 Others
    15.4 South America
        15.4.1 Brazil
        15.4.2 Argentina
        15.4.3 Others
    15.5 RoW
        15.5.1 Middle East
        15.5.2 Africa
16. Flip Chip Market- Market Entropy
    16.1 New product launches
    16.2 M&A's, collaborations, JVs and partnerships
17. Flip Chip Market– Industry Competition Landscape (Premium)
    17.1 Market Share Global
    17.2 Market Share by Region
    17.3 Market Share By Product Type
18. Flip Chip Market– Key Company List by Country Premium (Premium)
19. Flip Chip Market- Company Analysis
    19.1 Texas Instruments
    19.2 STMicroelectronics
    19.3 Intel Corporation
    19.4 Samsung Group
    19.5 Amkor Technology
    19.6 TDK Electronics Europe
    19.7 IBM Corporation
    19.8 Taiwan Semiconductor Manufacturing Company
    19.9 3M Company
    19.10 Kyocera International
    19.11 Others
"*Financials would be provided on a best-efforts basis for private companies*"
List of Tables

Table 1 Flip Chip Market Overview 2021-2026
Table 2 Flip Chip Market Leader Analysis 2018-2019 (US$)
Table 3 Flip Chip Market Product Analysis 2018-2019 (US$)
Table 4 Flip Chip Market End User Analysis 2018-2019 (US$)
Table 5 Flip Chip Market Patent Analysis 2013-2018* (US$)
Table 6 Flip Chip Market Financial Analysis 2018-2019 (US$)
Table 7 Flip Chip Market Driver Analysis 2018-2019 (US$)
Table 8 Flip Chip Market Challenges Analysis 2018-2019 (US$)
Table 9 Flip Chip Market Constraint Analysis 2018-2019 (US$)
Table 10 Flip Chip Market Supplier Bargaining Power Analysis 2018-2019 (US$)
Table 11 Flip Chip Market Buyer Bargaining Power Analysis 2018-2019 (US$)
Table 12 Flip Chip Market Threat of Substitutes Analysis 2018-2019 (US$)
Table 13 Flip Chip Market Threat of New Entrants Analysis 2018-2019 (US$)
Table 14 Flip Chip Market Degree of Competition Analysis 2018-2019 (US$)
Table 15 Flip Chip Market Value Chain Analysis 2018-2019 (US$)
Table 16 Flip Chip Market Pricing Analysis 2021-2026 (US$)
Table 17 Flip Chip Market Opportunities Analysis 2021-2026 (US$)
Table 18 Flip Chip Market Product Life Cycle Analysis 2021-2026 (US$)
Table 19 Flip Chip Market Supplier Analysis 2018-2019 (US$)
Table 20 Flip Chip Market Distributor Analysis 2018-2019 (US$)
Table 21 Flip Chip Market Trend Analysis 2018-2019 (US$)
Table 22 Flip Chip Market Size 2018 (US$)
Table 23 Flip Chip Market Forecast Analysis 2021-2026 (US$)
Table 24 Flip Chip Market Sales Forecast Analysis 2021-2026 (Units)
Table 25 Flip Chip Market, Revenue & Volume,By Packaging type, 2021-2026 ($)
Table 26 Flip Chip Market By Packaging type, Revenue & Volume,By Flip Chip Ball Grid Array (fcBGA) Technology, 2021-2026 ($)
Table 27 Flip Chip Market By Packaging type, Revenue & Volume,By Flip Chip Chip Scale Package (fcCSP) Technology, 2021-2026 ($)
Table 28 Flip Chip Market By Packaging type, Revenue & Volume,By Wafer Level Packaging, 2021-2026 ($)
Table 29 Flip Chip Market By Packaging type, Revenue & Volume,By Others, 2021-2026 ($)
Table 30 Flip Chip Market, Revenue & Volume,By joining process, 2021-2026 ($)
Table 31 Flip Chip Market By joining process, Revenue & Volume,By Introduction, 2021-2026 ($)
Table 32 Flip Chip Market By joining process, Revenue & Volume,By Solder Joining, 2021-2026 ($)
Table 33 Flip Chip Market By joining process, Revenue & Volume,By Thermo Compression, 2021-2026 ($)
Table 34 Flip Chip Market By joining process, Revenue & Volume,By Thermo Sonic Joining, 2021-2026 ($)
Table 35 Flip Chip Market By joining process, Revenue & Volume,By Joining by Adhesive, 2021-2026 ($)
Table 36 Flip Chip Market, Revenue & Volume,By bumping process, 2021-2026 ($)
Table 37 Flip Chip Market By bumping process, Revenue & Volume,By Introduction, 2021-2026 ($)
Table 38 Flip Chip Market By bumping process, Revenue & Volume,By Copper (Cu) pillar, 2021-2026 ($)
Table 39 Flip Chip Market By bumping process, Revenue & Volume,By Lead (Pb) – free solder, 2021-2026 ($)
Table 40 Flip Chip Market By bumping process, Revenue & Volume,By Tin-Lead (Sn-Pb) eutectic solder, 2021-2026 ($)
Table 41 Flip Chip Market By bumping process, Revenue & Volume,By Gold stud and Plated solder, 2021-2026 ($)
Table 42 Flip Chip Market, Revenue & Volume,By Application, 2021-2026 ($)
Table 43 Flip Chip Market By Application, Revenue & Volume,By Introduction, 2021-2026 ($)
Table 44 Flip Chip Market By Application, Revenue & Volume,By 2D logic system-on-a-chip (SoC), 2021-2026 ($)
Table 45 Flip Chip Market By Application, Revenue & Volume,By Light Emitting Diode, 2021-2026 ($)
Table 46 Flip Chip Market By Application, Revenue & Volume,By Memory, 2021-2026 ($)
Table 47 Flip Chip Market By Application, Revenue & Volume,By Imaging, 2021-2026 ($)
Table 48 Flip Chip Market, Revenue & Volume,By End Use, 2021-2026 ($)
Table 49 Flip Chip Market By End Use, Revenue & Volume,By Introduction, 2021-2026 ($)
Table 50 Flip Chip Market By End Use, Revenue & Volume,By Telecommunications, 2021-2026 ($)
Table 51 Flip Chip Market By End Use, Revenue & Volume,By Consumer Electronics, 2021-2026 ($)
Table 52 Flip Chip Market By End Use, Revenue & Volume,By Automotive, 2021-2026 ($)
Table 53 Flip Chip Market By End Use, Revenue & Volume,By Industrial, 2021-2026 ($)
Table 54 North America Flip Chip Market, Revenue & Volume,By Packaging type, 2021-2026 ($)
Table 55 North America Flip Chip Market, Revenue & Volume,By joining process, 2021-2026 ($)
Table 56 North America Flip Chip Market, Revenue & Volume,By bumping process, 2021-2026 ($)
Table 57 North America Flip Chip Market, Revenue & Volume,By Application, 2021-2026 ($)
Table 58 North America Flip Chip Market, Revenue & Volume,By End Use, 2021-2026 ($)
Table 59 South america Flip Chip Market, Revenue & Volume,By Packaging type, 2021-2026 ($)
Table 60 South america Flip Chip Market, Revenue & Volume,By joining process, 2021-2026 ($)
Table 61 South america Flip Chip Market, Revenue & Volume,By bumping process, 2021-2026 ($)
Table 62 South america Flip Chip Market, Revenue & Volume,By Application, 2021-2026 ($)
Table 63 South america Flip Chip Market, Revenue & Volume,By End Use, 2021-2026 ($)
Table 64 Europe Flip Chip Market, Revenue & Volume,By Packaging type, 2021-2026 ($)
Table 65 Europe Flip Chip Market, Revenue & Volume,By joining process, 2021-2026 ($)
Table 66 Europe Flip Chip Market, Revenue & Volume,By bumping process, 2021-2026 ($)
Table 67 Europe Flip Chip Market, Revenue & Volume,By Application, 2021-2026 ($)
Table 68 Europe Flip Chip Market, Revenue & Volume,By End Use, 2021-2026 ($)
Table 69 APAC Flip Chip Market, Revenue & Volume,By Packaging type, 2021-2026 ($)
Table 70 APAC Flip Chip Market, Revenue & Volume,By joining process, 2021-2026 ($)
Table 71 APAC Flip Chip Market, Revenue & Volume,By bumping process, 2021-2026 ($)
Table 72 APAC Flip Chip Market, Revenue & Volume,By Application, 2021-2026 ($)
Table 73 APAC Flip Chip Market, Revenue & Volume,By End Use, 2021-2026 ($)
Table 74 Middle East & Africa Flip Chip Market, Revenue & Volume,By Packaging type, 2021-2026 ($)
Table 75 Middle East & Africa Flip Chip Market, Revenue & Volume,By joining process, 2021-2026 ($)
Table 76 Middle East & Africa Flip Chip Market, Revenue & Volume,By bumping process, 2021-2026 ($)
Table 77 Middle East & Africa Flip Chip Market, Revenue & Volume,By Application, 2021-2026 ($)
Table 78 Middle East & Africa Flip Chip Market, Revenue & Volume,By End Use, 2021-2026 ($)
Table 79 Russia Flip Chip Market, Revenue & Volume,By Packaging type, 2021-2026 ($)
Table 80 Russia Flip Chip Market, Revenue & Volume,By joining process, 2021-2026 ($)
Table 81 Russia Flip Chip Market, Revenue & Volume,By bumping process, 2021-2026 ($)
Table 82 Russia Flip Chip Market, Revenue & Volume,By Application, 2021-2026 ($)
Table 83 Russia Flip Chip Market, Revenue & Volume,By End Use, 2021-2026 ($)
Table 84 Israel Flip Chip Market, Revenue & Volume,By Packaging type, 2021-2026 ($)
Table 85 Israel Flip Chip Market, Revenue & Volume,By joining process, 2021-2026 ($)
Table 86 Israel Flip Chip Market, Revenue & Volume,By bumping process, 2021-2026 ($)
Table 87 Israel Flip Chip Market, Revenue & Volume,By Application, 2021-2026 ($)
Table 88 Israel Flip Chip Market, Revenue & Volume,By End Use, 2021-2026 ($)
Table 89 Top Companies 2018 (US$)Flip Chip Market, Revenue & Volume
Table 90 Product Launch 2018-2019Flip Chip Market, Revenue & Volume
Table 91 Mergers & Acquistions 2018-2019Flip Chip Market, Revenue & Volume


List of Figures

Figure 1 Overview of Flip Chip Market 2021-2026
Figure 2 Market Share Analysis for Flip Chip Market 2018 (US$)
Figure 3 Product Comparison in Flip Chip Market 2018-2019 (US$)
Figure 4 End User Profile for Flip Chip Market 2018-2019 (US$)
Figure 5 Patent Application and Grant in Flip Chip Market 2013-2018* (US$)
Figure 6 Top 5 Companies Financial Analysis in Flip Chip Market 2018-2019 (US$)
Figure 7 Market Entry Strategy in Flip Chip Market 2018-2019
Figure 8 Ecosystem Analysis in Flip Chip Market 2018
Figure 9 Average Selling Price in Flip Chip Market 2021-2026
Figure 10 Top Opportunites in Flip Chip Market 2018-2019
Figure 11 Market Life Cycle Analysis in Flip Chip Market
Figure 12 GlobalBy Packaging typeFlip Chip Market Revenue, 2021-2026 ($)
Figure 13 GlobalBy joining processFlip Chip Market Revenue, 2021-2026 ($)
Figure 14 GlobalBy bumping processFlip Chip Market Revenue, 2021-2026 ($)
Figure 15 GlobalBy ApplicationFlip Chip Market Revenue, 2021-2026 ($)
Figure 16 GlobalBy End UseFlip Chip Market Revenue, 2021-2026 ($)
Figure 17 Global Flip Chip Market - By Geography
Figure 18 Global Flip Chip Market Value & Volume, By Geography, 2021-2026 ($) 
Figure 19 Global Flip Chip Market CAGR, By Geography, 2021-2026 (%)
Figure 20 North America Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 21 US Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 22 US GDP and Population, 2018-2019 ($)
Figure 23 US GDP – Composition of 2018, By Sector of Origin
Figure 24 US Export and Import Value & Volume, 2018-2019 ($)
Figure 25 Canada Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 26 Canada GDP and Population, 2018-2019 ($)
Figure 27 Canada GDP – Composition of 2018, By Sector of Origin
Figure 28 Canada Export and Import Value & Volume, 2018-2019 ($)
Figure 29 Mexico Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 30 Mexico GDP and Population, 2018-2019 ($)
Figure 31 Mexico GDP – Composition of 2018, By Sector of Origin
Figure 32 Mexico Export and Import Value & Volume, 2018-2019 ($)
Figure 33 South America Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 34 Brazil Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 35 Brazil GDP and Population, 2018-2019 ($)
Figure 36 Brazil GDP – Composition of 2018, By Sector of Origin
Figure 37 Brazil Export and Import Value & Volume, 2018-2019 ($)
Figure 38 Venezuela Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 39 Venezuela GDP and Population, 2018-2019 ($)
Figure 40 Venezuela GDP – Composition of 2018, By Sector of Origin
Figure 41 Venezuela Export and Import Value & Volume, 2018-2019 ($)
Figure 42 Argentina Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 43 Argentina GDP and Population, 2018-2019 ($)
Figure 44 Argentina GDP – Composition of 2018, By Sector of Origin
Figure 45 Argentina Export and Import Value & Volume, 2018-2019 ($)
Figure 46 Ecuador Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 47 Ecuador GDP and Population, 2018-2019 ($)
Figure 48 Ecuador GDP – Composition of 2018, By Sector of Origin
Figure 49 Ecuador Export and Import Value & Volume, 2018-2019 ($)
Figure 50 Peru Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 51 Peru GDP and Population, 2018-2019 ($)
Figure 52 Peru GDP – Composition of 2018, By Sector of Origin
Figure 53 Peru Export and Import Value & Volume, 2018-2019 ($)
Figure 54 Colombia Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 55 Colombia GDP and Population, 2018-2019 ($)
Figure 56 Colombia GDP – Composition of 2018, By Sector of Origin
Figure 57 Colombia Export and Import Value & Volume, 2018-2019 ($)
Figure 58 Costa Rica Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 59 Costa Rica GDP and Population, 2018-2019 ($)
Figure 60 Costa Rica GDP – Composition of 2018, By Sector of Origin
Figure 61 Costa Rica Export and Import Value & Volume, 2018-2019 ($)
Figure 62 Europe Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 63 U.K Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 64 U.K GDP and Population, 2018-2019 ($)
Figure 65 U.K GDP – Composition of 2018, By Sector of Origin
Figure 66 U.K Export and Import Value & Volume, 2018-2019 ($)
Figure 67 Germany Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 68 Germany GDP and Population, 2018-2019 ($)
Figure 69 Germany GDP – Composition of 2018, By Sector of Origin
Figure 70 Germany Export and Import Value & Volume, 2018-2019 ($)
Figure 71 Italy Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 72 Italy GDP and Population, 2018-2019 ($)
Figure 73 Italy GDP – Composition of 2018, By Sector of Origin
Figure 74 Italy Export and Import Value & Volume, 2018-2019 ($)
Figure 75 France Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 76 France GDP and Population, 2018-2019 ($)
Figure 77 France GDP – Composition of 2018, By Sector of Origin
Figure 78 France Export and Import Value & Volume, 2018-2019 ($)
Figure 79 Netherlands Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 80 Netherlands GDP and Population, 2018-2019 ($)
Figure 81 Netherlands GDP – Composition of 2018, By Sector of Origin
Figure 82 Netherlands Export and Import Value & Volume, 2018-2019 ($)
Figure 83 Belgium Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 84 Belgium GDP and Population, 2018-2019 ($)
Figure 85 Belgium GDP – Composition of 2018, By Sector of Origin
Figure 86 Belgium Export and Import Value & Volume, 2018-2019 ($)
Figure 87 Spain Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 88 Spain GDP and Population, 2018-2019 ($)
Figure 89 Spain GDP – Composition of 2018, By Sector of Origin
Figure 90 Spain Export and Import Value & Volume, 2018-2019 ($)
Figure 91 Denmark Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 92 Denmark GDP and Population, 2018-2019 ($)
Figure 93 Denmark GDP – Composition of 2018, By Sector of Origin
Figure 94 Denmark Export and Import Value & Volume, 2018-2019 ($)
Figure 95 APAC Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 96 China Flip Chip Market Value & Volume, 2021-2026
Figure 97 China GDP and Population, 2018-2019 ($)
Figure 98 China GDP – Composition of 2018, By Sector of Origin
Figure 99 China Export and Import Value & Volume, 2018-2019 ($)Flip Chip Market China Export and Import Value & Volume, 2018-2019 ($)
Figure 100 Australia Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 101 Australia GDP and Population, 2018-2019 ($)
Figure 102 Australia GDP – Composition of 2018, By Sector of Origin
Figure 103 Australia Export and Import Value & Volume, 2018-2019 ($)
Figure 104 South Korea Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 105 South Korea GDP and Population, 2018-2019 ($)
Figure 106 South Korea GDP – Composition of 2018, By Sector of Origin
Figure 107 South Korea Export and Import Value & Volume, 2018-2019 ($)
Figure 108 India Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 109 India GDP and Population, 2018-2019 ($)
Figure 110 India GDP – Composition of 2018, By Sector of Origin
Figure 111 India Export and Import Value & Volume, 2018-2019 ($)
Figure 112 Taiwan Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 113 Taiwan GDP and Population, 2018-2019 ($)
Figure 114 Taiwan GDP – Composition of 2018, By Sector of Origin
Figure 115 Taiwan Export and Import Value & Volume, 2018-2019 ($)
Figure 116 Malaysia Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 117 Malaysia GDP and Population, 2018-2019 ($)
Figure 118 Malaysia GDP – Composition of 2018, By Sector of Origin
Figure 119 Malaysia Export and Import Value & Volume, 2018-2019 ($)
Figure 120 Hong Kong Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 121 Hong Kong GDP and Population, 2018-2019 ($)
Figure 122 Hong Kong GDP – Composition of 2018, By Sector of Origin
Figure 123 Hong Kong Export and Import Value & Volume, 2018-2019 ($)
Figure 124 Middle East & Africa Flip Chip Market Middle East & Africa 3D Printing Market Value & Volume, 2021-2026 ($)
Figure 125 Russia Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 126 Russia GDP and Population, 2018-2019 ($)
Figure 127 Russia GDP – Composition of 2018, By Sector of Origin
Figure 128 Russia Export and Import Value & Volume, 2018-2019 ($)
Figure 129 Israel Flip Chip Market Value & Volume, 2021-2026 ($)
Figure 130 Israel GDP and Population, 2018-2019 ($)
Figure 131 Israel GDP – Composition of 2018, By Sector of Origin
Figure 132 Israel Export and Import Value & Volume, 2018-2019 ($)
Figure 133 Entropy Share, By Strategies, 2018-2019* (%)Flip Chip Market 
Figure 134 Developments, 2018-2019*Flip Chip Market 
Figure 135 Company 1 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 136 Company 1 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 137 Company 1 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 138 Company 2 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 139 Company 2 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 140 Company 2 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 141 Company 3Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 142 Company 3Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 143 Company 3Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 144 Company 4 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 145 Company 4 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 146 Company 4 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 147 Company 5 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 148 Company 5 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 149 Company 5 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 150 Company 6 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 151 Company 6 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 152 Company 6 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 153 Company 7 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 154 Company 7 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 155 Company 7 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 156 Company 8 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 157 Company 8 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 158 Company 8 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 159 Company 9 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 160 Company 9 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 161 Company 9 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 162 Company 10 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 163 Company 10 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 164 Company 10 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 165 Company 11 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 166 Company 11 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 167 Company 11 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 168 Company 12 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 169 Company 12 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 170 Company 12 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 171 Company 13Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 172 Company 13Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 173 Company 13Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 174 Company 14 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 175 Company 14 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 176 Company 14 Flip Chip Market Net Sales Share, By Geography, 2018 (%)
Figure 177 Company 15 Flip Chip Market Net Revenue, By Years, 2018-2019* ($)
Figure 178 Company 15 Flip Chip Market Net Revenue Share, By Business segments, 2018 (%)
Figure 179 Company 15 Flip Chip Market Net Sales Share, By Geography, 2018 (%)