Flip Chip technology
is the method for interconnecting semiconductor devices such as Integrated Circuit chips and Micro-electromechanical systems (MEMS) to external circuitry with solder bumps that have been deposited on the chip pads. The chip is then mounted on the external circuitry with its top side down and properly aligned such that its pads align with the matching pads on the external circuit. Flip Chip offers reduced size of the devices (as packaging density increases) and increased performance. It is cheaper than wire bonding as all the bonds form simultaneously.
The Report ‘Flip Chip Market
is segmented into six verticals, namely: By Joining Process, By Bumping Process, By Packaging, By Application, By End users and By Geography. The report is segmented by joining process into Solder joining, Thermo Compression, Thermo Sonic, Adhesive and few others. The report has been divided in terms of Bumping Processes like Copper Pillar, Lead-Free Solder, Tin-Lead eutectic solder, Gold stud and plated Solder and others. On the basis of Type of Packaging, The report is segmented into Flip Chip Ball Grid Array (fcBGA), Flip Chip Chip Scale Package (fcCSP), Wafer Level Packaging and others. The report also discusses the applications like 2D Logic System-on-a-chip, Light Emitting Diode, Imaging, Memory, ICs and many others. The report also distinguishes among the end users such as Telecommunications, Consumer Electronics, Automotive, Industrial, Medical devices and others. The report analyzes the market over the regions like North America, South America, APAC, Europe and Rest of the World.
Flip Chip Market in 2015 was dominated by North America; and closely followed by Europe. The APAC region is the fastest growing market of Flip Chip. Countries in APAC are major manufacturing hubs and are instrumental in increasing the demand. Higher demand of Smartphones and Automobile MCUs globally also enhances the growth of the market.
Sample Companies profiled in this Report are:
- Taiwan Semiconductor Manufacturing Companies Ltd. (Taiwan)
- Samsung Group (South Korea)
- Powertech Technology (Taiwan)
- STATS ChipPAC Pte. Ltd. (Singapore)
- Amkor Technology (The U.S.)
The methodology for estimating the Flip Chip Market is depended on the type of Packaging. 3D IC packaging technology has the highest growth rate. Considering the Applications part, Consumer Electronics has the largest market size and also the highest growth rate. Simultaneously, the companies involved in Flip Chip Market are also studied from the perspective of their product portfolio, annual turnover and other parameters. The data was validated with industry experts at technical and market levels.