3D IC And 2.5D IC Market - Forecast(2024 - 2030)

Report Code: ESR 56335 Report Format: PDF + Excel

3D IC And 2.5D IC Market Overview

The 3D IC And 2.5D IC Market size is estimated at US$158.15 billion in 2021. The market is expected to reach US$180.53 billion by 2027, growing at a CAGR of 12.9% during 2022-2027. Rapid growth in end-user industries such as consumer electronics, Automotive, Medical Devices, Smart Devices and others in emerging economies; technological advancements and the drastic reduction in costs are some of the major factors that are driving the growth of this market. Other efficiencies such as low power consumption, increased speed of connectivity and others are also influencing the market positively. The technological advancements in FPGA (Field Programmable Gate Arrays), such as allowing developers to reconfigure different logic functions and reconfigurable computing, are major factors driving the growth of the market. Increased density of wafer-level packages to enhance memory applications and supply chain shocks that slowed down the production of metal-oxide semiconductors have compelled different national governments to legislate the onshoring of manufacturing facilities of such critical components. The ability to integrate different devices of varied origins in a system on a chip has enhanced the performance of such systems. This has resulted in the widespread integration of these systems into modern electronic devices. Such developments would propel the growth of the market in the forecast period.

3D IC And 2.5D IC Market Report Coverage

The 3D IC And 2.5D IC Market Report - Forecast (2022-2027)” by IndustryARC, covers an in-depth analysis of the following segments in the 3D IC And 2.5D IC Market.

By Technology: 3D wafer-level chip-scale packaging, 3D TSV and 2.5D.
By Application: Imaging & Optoelectronics, LED, Logic, MEMS/Sensors, Memory, Photonics RF and Others.
By End-users: Telecommunication, Consumer Electronics, Automotive, Defense, Medical and Smart Devices and Others.
By Geography: North America (the US, Canada and Mexico), Europe (the UK, Germany, France, Italy, Spain and Others), APAC (China, Japan, South Korea, India, Australia and Others), South America (Brazil, Argentina and Others) and RoW (the Middle East and Africa).

Key Takeaways

  • By end-users, Consumer Electronics would be the fastest-growing segment in this market with a CAGR of about 13.45% due to technological advancements, miniaturization of gadgets and rising discretionary incomes.
  • By technology, 3D wafer-level chip-scale packaging is the fastest-growing segment in this market with a CAGR of 13.86%. The growth is driven by competitive advantages such as low power consumption, greater performance and lower spatial requirements.
  • APAC region holds the 38% market share due to rapid economic growth, governmental policies and exponential growth in end-user industries.

3D IC And 2.5D IC Market Value Share, by Geography 2021, (%)

3D IC And 2.5D IC Market

For More Details on This Report - Request for Sample

3D IC And 2.5D IC Market Segment Analysis - by Technology

The 3D IC And 2.5D IC Market by type can be classified into three segments such as 3D wafer-level chip-scale packaging, 3D TSV and 2.5D. Among them, 3D wafer-level chip-scale packaging is projected to have the fastest growth at a CAGR of 13.86% during the forecast period of 2022-2027. Greater performance, lower power consumption and considerably lower spatial requirements are some of the key factors that are driving the growth of this segment. 3D integration enables the integration of analogue and digital circuit blocks into the same package with fewer signal integrity concerns and without significantly increasing the package size. Vertically stacked 3D IC can be kept very thin, resulting in space saving. In Feb 2021, Siemens Digital Industries Software launched a partnership with Advanced Semiconductor Engineering to develop a single platform from 2.5D and 3D packaging to fan-out wafer-level packaging (FOWLP) technologies which would enhance the capabilities of the companies to conduct further cutting-edge research in the future with greater use and bring this technology into the mainstream. Such developments would positively impact the growth of the market.

3D IC And 2.5D IC Market Segment Analysis - by End-user

3D IC And 2.5D IC have varied applications across different sectors such as Telecommunication, Consumer Electronics, Automotive, Defense, Medical and Smart Devices and others. Among them, the Consumer Electronics segment would exhibit the fastest growth at a CAGR of 13.45% in the forecast period 2022-2027. Rapid economic growth, rising discretionary incomes and a drastic reduction in the cost price of electronic gadgets have resulted in the exponential growth of the consumer electronics industry, especially in emerging economies such as China and India. The rapid miniaturization of devices in the consumer electronics industry has led to a decrease in chip size up to 5nm. This is resulting in the widespread adoption of 2.5 and 3d ICs by semiconductor fabrication and foundries to produce low-power, high-performance devices compatible with the electronic gadgets of modern times. In May 2022, TSMC announced the production of A16 chips for the Apple iPhone 14 series on the same 5nm fab as the A15 chip which would help with minor improvements. Such developments would rapidly accelerate the growth of the market.

3D IC And 2.5D IC Market Segment Analysis - by Geography

The 3D IC And 2.5D IC Market in the APAC region dominated in terms of revenue with a market share of 38% in 2021. The rapid economic growth, increased discretionary spending and the necessities of a fast-paced world have resulted in the exponential growth of industries such as consumer electronics, automotive and others. The exponential sales growth in smartphones, passenger cars and other consumer goods has been one of the key factors that are driving the growth of this market. Apart from this, the recent supply chain shocks due to the zero COVID policy and the concept of “resilient supply chains” have resulted in major economies trying to ‘onshore’ the production facilities of critical industrial components such as IC, semiconductors and others. In February 2022, Vedanta and Foxconn signed an MOU for Manufacturing Semiconductors in India. Such developments would propel the rapid expansion of this market.

3D IC And 2.5D IC Market Drivers 

Changing business landscapes, supply chain shocks and exponential growth of End-user Industries:

Changing consumer requirements, the exponential growth of end-user industries and global uncertainties amidst the pandemic due to unforeseen constraints in international mobility have made an impact on the market. These factors have compelled respective governments to frame policies to set up domestic semiconductor and chip manufacturing facilities to reduce their exposure to international turbulences. The increasing miniaturization of consumer gadgets, increased sophistication in automobile electronics and rapid adoption of advanced integrated circuits by the advanced militaries of the world are some of the major factors driving the growth of this market. Apart from this, the supply chain shocks due to the onset of the pandemic led to severe production bottlenecks which resulted in a significant loss of economic activity. These developments have resulted in different central governments providing incentives to set up industries in their respective countries which would lead to a rapid expansion of the market.

Rapid Adoption of 3D IC And 2.5D IC due to the incorporation of advanced technologies such as Wafer-to-wafer Bonding, Cooling Chips with Microjet and Others:

Rapid technological advancements in 3d and 2.5d ICs such as Wafer-to-wafer Bonding, Cooling Chips with Microjet and others have played a key role in driving the growth of the 3D IC And 2.5D IC Market. Reduction in the distance between chip connections in hybrid wafer-to-wafer bonding, area reductions in wafer-to-wafer bonding via the reduction in TSVs and collective bonding in the case of die-to-wafer transfer are some of the major technological advancements that are revolutionizing this industry. Such advancements would enhance the capabilities of the chip manufacturers to produce devices that are compatible with the consumer electronics industry, the ability to stack wafers which are essential for memory applications and heterogeneous integration. These factors would result in a rapid expansion of this market.

3D IC And 2.5D IC Market Challenge

High Initial cost of installation and maintenance, lack of skilled labor and supply-chain shocks:

High capital expenditure, lack of skilled manpower and other technological glitches are some of the major factors that are inhibiting the growth of the 2.5d and 3d IC market. The complicated process of producing wafers and other devices, the unreliability of the supply chain and increasing costs are creating major headwinds for the industry. The inflationary pressures that have been created due to excess liquidity in global markets and loose fiscal policy adopted by the governments of the advanced economies to restart their economies have led the central banks to raise rates. This would lead to a slowdown in investments and hamper the growth of the industry. In May 2022, Samsung announced that it would raise the prices of its chips by 20% due to rising material costs. 

Key Market Players

Product launches, collaborations and R&D activities are key strategies adopted by players in the 3D IC And 2.5D IC Market. The top 10 companies in the 3D IC And 2.5D IC Market are:

  1. TSMC
  2. Samsung
  3. TOSHIBA
  4. ASE Group
  5. Amkor
  6. UMC
  7. STMicroelectronics
  8. Broadcom
  9.  Intel
  10. Fujitsu Limited

Recent Developments

  • In June 2022, TSMC announced that it would use nanosheet technology for the production of its next 2nm node to reduce energy consumption in high computing systems. Such developments would solve many longstanding problems and allow them to develop low-power, microdevices with enhanced performance for the needs of the industry.
  • In May 2022, TSMC announced that it would be developing a multi-billion-dollar chip plant in Singapore to address the global supply shortage, the ripple effects of which were felt by industries across the world. Such developments are going to positively impact the market.
  • In May 2022, Google announced that Samsung would be making its “next-gen” tensor processor for Pixel 7 and 7 Pro. This processor would be made from a 4nm process along with the application of PLP (Panel Level Package) technology which would minimize the discarded edge, thereby reducing cost and improving productivity.

Relevant Reports

Chip Antenna Market - Industry Analysis, Market Size, Share, Trends, Application Analysis, Growth and Forecast Analysis

Report Code: ESR 0428

Semiconductor Market - Industry Analysis, Market Size, Share, Trends, Application Analysis, Growth and Forecast Analysis

Report Code: ESR 0563

GNSS Chip Market - Industry Analysis, Market Size, Share, Trends, Application Analysis, Growth and Forecast Analysis

Report Code: ESR 92500

For more Electronics Market reports, please click here

1. 3D IC And 2.5D IC Market - Market Overview
    1.1 Definitions and Scope
2. 3D IC And 2.5D IC Market - Executive Summary
    2.1 Market Revenue, Market Size and Key Trends by Company
    2.2 Key trends by type
    2.3 Key trends segmented by Geography
3. 3D IC And 2.5D IC Market
    3.1 Comparative Analysis
        3.1.1 Product/Service Benchmarking - Top 5 Companies
        3.1.2 Top 5 Financial Analysis
        3.1.3 Market Value Split by Top 5 Companies
        3.1.4 Patent Analysis
        3.1.5 Pricing Analysis
4. 3D IC And 2.5D IC Market – Startup Companies Scenario Premium 
    4.1 Top 10 Startup Company Analysis by
        4.1.1 Investment
        4.1.2 Revenue
        4.1.3 Market Share
        4.1.4 Market S Size and Application Analysis
        4.1.5 Venture Capital and Funding Scenario
5. 3D IC And 2.5D IC Market – Market Entry Scenario Premium Premium
    5.1 Regulatory Framework Overview
    5.2 New Business and Ease of Doing Business Index
    5.3 Case Studies of Successful Ventures
    5.4 Customer Analysis – Top 10 Companies
6. 3D IC And 2.5D IC Market - Market Forces
    6.1 Market Drivers
    6.2 Market Constraints/Challenges
    6.3 Porter's five force model
        6.3.1 Bargaining power of suppliers
        6.3.2 Bargaining powers of customers
        6.3.3 Threat of new entrants
        6.3.4 Rivalry among existing players
        6.3.5 Threat of substitutes
7. 3D IC And 2.5D IC Market – by Strategic Analysis (Market Size - $Million/Billion)
    7.1 Value Chain Analysis
    7.2 Opportunities Analysis
    7.3 Product Life Cycle/Market Life Cycle Analysis
    7.4 Suppliers and Distributors
8. 3D IC And 2.5D IC Market - by Technology
    8.1 3D wafer-level chip-scale packaging
    8.2 3D TSV
    8.3 2.5D
9. 3D IC And 2.5D IC Market - by Application
    9.1 Imaging & Optoelectronics
    9.2 LED
    9.3 Logic
    9.4 MEMS/Sensors
    9.5 Memory
    9.6 Photonics
    9.7 RF
    9.8 Others
10. 3D IC And 2.5D IC Market - by End-users
    10.1 Telecommunication
    10.2 Consumer Electronics
    10.3 Automotive
    10.4 Defence
    10.5 Medical and Smart Devices
    10.6 Others
11. 3D IC And 2.5D IC Market - by Geography (Market Size - $Million)
    11.1 North America
        11.1.1 The U.S.
        11.1.2 Canada
        11.1.3 Mexico
    11.2 South America
        11.2.1 Brazil
        11.2.2 Argentina
        11.2.3 The Rest of the Americas
    11.3 Europe
        11.3.1 The UK
        11.3.2 Germany
        11.3.3 France
        11.3.4 Italy
        11.3.5 The Netherlands
        11.3.6 The Rest of Europe
    11.4 Asia-Pacific (APAC)
        11.4.1 China
        11.4.2Japan
        11.4.3 India
        11.4.4 South Korea
        11.4.5 Australia & New Zealand
        11.4.6 The Rest of APAC
    11.5 The Rest of World (RoW)
        11.5.1 The Middle East
        11.5.2 Africa
12. 3D IC And 2.5D IC Market - Market Entropy
    12.1 New Product Launches
    12.2 M&As, Collaborations, JVs and Partnerships
13. 3D IC And 2.5D IC Market - Industry/Segment Competition Landscape Premium 
    13.1 Market Share Analysis
        13.1.1 Market Share by Country - Top 5 Companies
        13.1.2 Market Share by Region - Top 10 Companies
        13.1.3 Market Share by Type of Application - Top 10 Companies
        13.1.4 Market Share by Type of Product/ Product Category - Top 10 Companies
        13.1.5 Market Share at Global Level - Top 10 Companies
        13.1.6 Best Practices For Companies 
14. 3D IC And 2.5D IC Market – Key Company List by Country Premium Premium 
15. 3D IC And 2.5D IC Market - Company Analysis
    15.1 TSMC
    15.2 Samsung
    15.3 TOSHIBA
    15.4 ASE Group
    15.5 Amkor
    15.6 UMC
    15.7 STMicroelectronics
    15.8 Broadcom
    15.9 Intel
    15.10 Fujitsu Limited
*"Financials would be provided to private companies on best-efforts basis."
Connect with our experts to get customized reports that best suit your requirements. Our reports include global-level data, niche markets and competitive landscape.